发明名称 |
Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom |
摘要 |
<p>A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer.</p> |
申请公布号 |
GB2455917(B) |
申请公布日期 |
2011.08.17 |
申请号 |
GB20090002189 |
申请日期 |
2007.07.27 |
申请人 |
WORLD PROPERTIES, INC. |
发明人 |
SANKAR K PAUL |
分类号 |
H05K3/38;B05D7/16;C08L15/00;C08L71/12;C09J107/00;C09J171/02 |
主分类号 |
H05K3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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