发明名称 Electron beam enhanced surface wave plasma source
摘要 A plasma processing system is described for generating plasma with a ballistic electron beam using a surface wave plasma (SWP) source, such as a radial line slot antenna (RLSA) during semiconductor device fabrication. The antenna comprises a resonator plate having a partially open, electrically conductive layer coupled to a surface of the resonator plate. For example, the electrically conductive layer is formed at an interface between the resonator plate and the plasma, and a direct current (DC) voltage is applied to the electrically conductive layer.
申请公布号 US7998307(B2) 申请公布日期 2011.08.16
申请号 US20060518884 申请日期 2006.09.12
申请人 TOKYO ELECTRON LIMITED 发明人 CHEN LEE;MOROZ PAUL
分类号 C23C16/00;A62D3/00;C23C14/00;C23F1/00;H01L21/306 主分类号 C23C16/00
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