发明名称 |
Void reduction in indium thermal interface material |
摘要 |
Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling.
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申请公布号 |
US7999394(B2) |
申请公布日期 |
2011.08.16 |
申请号 |
US20090638112 |
申请日期 |
2009.12.15 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
TOO SEAH SUN;LIAU HSIANG WAN;KIRKLAND JANET;TAN TEK SENG;TOUZELBAEV MAXAT;MASTER RAJ N. |
分类号 |
H01L23/48;H01L23/12 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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