发明名称 Method of producing a solid-state imaging device
摘要 To provide a solid-state imaging device able to improve light transmittance of a transparent insulation film in a light incident side of a substrate, suppress the dark current, and prevent a quantum efficiently loss, wherein a pixel circuit is formed in a first surface of the substrate and light is received from a second surface, and having: a light receiving unit formed in the substrate and for generating a signal charge corresponding to an amount of incidence light and storing it; a transparent first insulation film formed on the second surface; and a transparent second insulation film formed on the first insulation film and for retaining a charge having the same polarity as the signal charge in an interface of the first insulation film or in inside, thicknesses of the first and second insulation film being determined to obtain a transmittance higher than when using only the first insulation film.
申请公布号 US7998778(B2) 申请公布日期 2011.08.16
申请号 US20100662982 申请日期 2010.05.14
申请人 SONY CORPORATION 发明人 KANBE HIDEO;EZAKI TAKAYUKI
分类号 H01L31/18;H01L27/14;H01L27/146;H01L27/148;H01L31/10;H04N5/335;H04N5/361;H04N5/369 主分类号 H01L31/18
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