发明名称 |
Systems and methods for removing wafer edge residue and debris using a residue remover mechanism |
摘要 |
A system (500) removes wafer edge residue from a target wafer (508). A wafer holding mechanism (502) holds and rotates the target wafer (508). A residue remover mechanism (504) mechanically interacts or abrades an edge surface of the target wafer (508) and removes strongly adhered residue from the edge surface of the target wafer (508). The residue remover mechanism (504) controls coverage of the mechanical interaction and magnitude of the mechanical interaction.
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申请公布号 |
US7998865(B2) |
申请公布日期 |
2011.08.16 |
申请号 |
US20050141534 |
申请日期 |
2005.05.31 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
TRAN JOE G.;KIRKPATRICK BRIAN K.;GRIFFIN, JR. ALFRED J. |
分类号 |
H01L21/302 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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