发明名称 Copper-clad laminate
摘要 A copper-clad laminate is composed of a copper foil and an aromatic polyimide film placed thereon, in which the copper foil is bonded to the polyimide film at a bonding strength of ≧500 N/m and the polyimide film shows a light transmittance of ≧40% for a light of wavelength of 600 nm and a haze of ≧30% [the light transmittance and haze are values measured after the copper foil is removed by etching].
申请公布号 US7998553(B2) 申请公布日期 2011.08.16
申请号 US20100838808 申请日期 2010.07.19
申请人 UBE INDUSTRIES, LTD. 发明人 NARUI KOHJI;YAMAMOTO NOBUYUKI;ANNO TOSHIHIKO
分类号 B32B15/08;H05K1/03;H05K3/02;H05K3/38 主分类号 B32B15/08
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