发明名称 Semiconductor device and manufacturing method thereof
摘要 A semiconductor device includes an n-conductive type semiconductor substrate having a main side and a rear side, a p-conductive type layer arranged over the main side of the substrate, a main side n-conductive type region arranged in the p-conductive type layer, a rear side n-conductive type layer arranged over the rear side of the substrate, a first trench which reaches the substrate and penetrates the main side n-conductive type region and the p-conductive type layer, a second trench which reaches an inside of the p-conductive type layer, a second electrode layer, which is embedded in the second trench and connected to the p-conductive type layer. Hereby, the semiconductor device, in which the recovery property of a diode cell can be improved without damaging the property of a MOS transistor cell or an IGBT cell and the surge withstand property does not deteriorate, can be obtained.
申请公布号 US7999314(B2) 申请公布日期 2011.08.16
申请号 US20080213469 申请日期 2008.06.19
申请人 DENSO CORPORATION 发明人 TSUZUKI YUKIO;ASAI MAKOTO
分类号 H01L29/66;H01L21/336;H01L21/8234;H01L29/772;H01L29/78 主分类号 H01L29/66
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