发明名称 |
Multilayered polymeric structure |
摘要 |
A multilayered polymeric structure having at least two polymeric layers is provided, each layer being a mixture of a polymeric composition with carbon fibrils. The multilayer polymeric structure may include an electrically conductive material between the first and second polymeric layers. A process for making a multilayered polymeric structure for packaging electronic components is also provided. The multilayered polymeric material is used to form trays and packages for containing electrical components.
|
申请公布号 |
US7998386(B2) |
申请公布日期 |
2011.08.16 |
申请号 |
US20070841626 |
申请日期 |
2007.08.20 |
申请人 |
HYPERION CATALYSIS INTERNATIONAL, INC. |
发明人 |
FRIEND STEPHEN O.;BRYANT EDWARD W. S.;FOWLER HAROLD C. |
分类号 |
B29C65/00;B65D1/00;B32B7/02;B32B27/18;B32B27/20;B32B27/36;B65D65/40;B65D85/86;C08K3/04;C08L101/00;H01B1/24;H05K9/00 |
主分类号 |
B29C65/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|