发明名称 Single footprint family of integrated power modules
摘要 A system and method for producing a family of power modules having a common footprint that enables the customer to flexibly choose a power module size without incurring the costs of a relayout of a system design. In one embodiment, a board layout can be designed using a selected power module footprint size that supports an installation of any of a plurality of power modules. The power module that is used in a board layout can be selected based on a measurement of an amount of power consumed by the one or more loads.
申请公布号 US7996987(B2) 申请公布日期 2011.08.16
申请号 US20060581354 申请日期 2006.10.17
申请人 BROADCOM CORPORATION 发明人 DIAB WAEL WILLIAM;ELKAYAM SHIMON
分类号 H05K3/30;H01S4/00 主分类号 H05K3/30
代理机构 代理人
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