发明名称 Memory cell structure and method for fabrication thereof
摘要 A memory cell includes a substrate, an access transistor and a storage capacitor. The access transistor comprising a gate stack disposed on the substrate, and a first and second diffusion region located on a first and second opposing sides of the gate stack. The storage capacitor comprises a first capacitor plate comprising a portion embedded within the substrate below the first diffusion region, a second capacitor plate and a capacitor dielectric sandwiched between the embedded portion of the first capacitor plate. At least a portion of the first diffusion region forms the second capacitor plate.
申请公布号 US7999300(B2) 申请公布日期 2011.08.16
申请号 US20090361521 申请日期 2009.01.28
申请人 GLOBALFOUNDRIES SINGAPORE PTE. LTD. 发明人 LUN ZHAO;LEE JAMES YONG MENG;TEO LEE WEE;TAN SHYUE SENG;LAI CHUNG WOH;WIDODO JOHNNY;MISHRA SHAILENDRA;CHEE JEFFREY
分类号 H01L27/108 主分类号 H01L27/108
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