| 摘要 |
THE INVENTION CONCERNS MULTILAYERED CONSTRUCTIONS USEFUL FOR FORMING RESISTORS AND CAPACITORS, FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS OR OTHER MICROELECTRONIC DEVICES. THE MULTILAYERED CONSTRUCTIONS COMPRISE SEQUENTIALLY ATTACHED LAYERS COMPRISING: A FIRST ELECTRICALLY CONDUCTIVE LAYER, A FIRST THERMOSETTING POLYMER LAYER, A HEAT RESISTANT FILM LAYER, A SECOND THERMOSETTING POLYMER LAYER, AND A NICKEL-PHOSPHORUS ELECTRICAL RESISTANCE MATERIAL LAYER ELECTROPLATED ONTO A SECOND ELECTRICALLY CONDUCTIVE LAYER. |
