FLEXIBLE HEIZKABELVORRICHTUNG

摘要

A cooling apparatus for cooling an electronic device 101 to be cooled includes a heat collector device 100 which is in thermal contact with the electronic device 101, a heat sink 200 for absorbing heat which is emitted from the heat collector device 100 and comprising a condenser unit 103 and a thermal interface unit 201, wherein the condenser unit 103 is cooled down via the thermal interface unit 201, and a heat transfer device 300 made from a flexible material for transferring heat which is emitted from the heat collector device 100 to the heat sink 200. The thermal interface unit 201 is designed as a thermal plug for connecting the condenser unit 103 of the heat sink 200 thermally and removably to an external cooling means.