| 摘要 |
THE OBJECT OF THE INVENTION IS TO PROVIDE A RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION REALIZING EXCELLENT SOLDERING RESISTANCE AND FLAME RESISTANCE AND HAVING EXCELLENT FLOWABILITY AND CURING PROPERTIES, AND A SEMICONDUCTOR DEVICE. THE INVENTION HAS SOLVED THE OBJECT BY A RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION COMPRISING (A) AN EPOXY RESIN CONTAINING (A) AN EPOXY RESIN REPRESENTED BY FORMULA (1) , (B) A COMPOUND HAVING TWO OR MORE PHENOLIC HYDROXYL GROUPS IN ITS MOLECULE, (C) AN INORGANIC FILLER, AND (D) A CURING ACCELERATOR: WHEREIN EACH OF R1 AND R2 REPRESENTS A HYDROGEN ATOM OR A HYDROCARBON GROUP WITH 4 OR LESS CARBON ATOMS AND MAY BE THE SAME OR DIFFERENT; AND 'N' REPRESENTS A MEAN VALUE THAT IS A POSITIVE NUMBER OF FROM 0 TO 5; IN THE FORMULA (1). |
