| 摘要 |
<p>This invention discloses a multilayer circuit board, which comprises a electron element located on or in the board, a conducting layer linked with the electron element, a high-temperature disfusing resin, adopting insulating material, and allocated to eliminate heat generated by the device, and a molding resin round the electron element, wherein, the heat generated by electron device of the circuit board, is conducted and eliminated by the resin material around about the device. The resion is an insulating material, so needs on consideration of short-circuit problem.</p> |
