| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which prevents a semiconductor chip from peeling off from an island, because of the generation of cracks on a die-bonding material. <P>SOLUTION: The semiconductor device includes the semiconductor chip and the island to which the semiconductor chip is die-bonded via the die-bonding material. The island has a die-bonding region onto which the semiconductor chip is die-bonded; in an outer periphery of the die-bonding region, a groove provided along at least a portion of the outer periphery of the die-bonding region is formed to pass through the proximity of each angle of the die-bonding region; and the die-bonding material is interposed between the whole area of the back surface of the semiconductor chip and the die-bonding region. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
