WIRING BOARD AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide an wiring board capable of suppressing an increase in production cost and corresponding to fine wiring, and its manufacturing method, and to provide a semiconductor package having the wiring board.

SOLUTION: The wiring board including a plurality of laminated ceramic layers and internal wiring includes: a ceramic substrate on which electrodes electrically connected with the internal wiring exposed from one surface; an wiring pattern formed on a main surface; and a silicon substrate having an wiring layer including a via fill with its one end electrically connected to the wiring pattern and the other end exposed from a rear surface opposite to the principal surface. The via fill of the silicon substrate is jointed to the electrode of the ceramic substrate through a metallic layer.

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