| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, capable of improving reliability by suppressing occurrence of a crack of a sealing layer due to thermal stress caused by the thermal expansion of the sealing layer. SOLUTION: The semiconductor device includes a semiconductor chip 2; a storage case 4, having an opening 4A on the upper side for storing the semiconductor chip 2 therein; a lid material 8 for closing the opening 4A; and a sealing layer 9 filled in the storage case 4 to embed the semiconductor chip 2, and the lid material 8 is provided on a surface facing the semiconductor chip 2, with a projecting part 8A planarly overlapping at least the semiconductor chip 2 and projecting to the semiconductor chip 2 side. COPYRIGHT: (C)2011,JPO&INPIT |
