| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of appropriately inspecting the pattern of each resist film or layer in a method of manufacturing a circuit board. SOLUTION: Regarding the circuit board 200, a layer of a predetermined pattern is formed by a series of steps including: a thin film-forming step of forming a thin film on a substrate 210; a resist film-forming step of forming a resist film on the thin film; an etching step of peeling the thin film using the resist film as a mask; and a resist peeling step of peeling the resist film. The series of steps are repeated. In an inspecting step, the pattern of the resist film or layer formed in the series of steps is inspected based on the image of the pattern of the resist film or layer formed in the series of steps and reference information including information of the pattern of the resist film or layer to be formed in the next step and later. COPYRIGHT: (C)2011,JPO&INPIT
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