| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming patterns on both faces of a transparent substrate, by which even when photoresist films disposed on transparent metal films on both faces of the transparent substrate are simultaneously subjected to different pattern exposure, transparent metal film patterns with good dimensional accuracy can be efficiently and easily formed on both faces of the transparent substrate after etching and peeling treatment. <P>SOLUTION: When transparent metal films 22A, 22B disposed on both front and rear faces of a transparent substrate 21 are patterned, an opaque layer 27 which blocks exposure light is formed on at least one of the transparent metal films and then photoresist films 23A, 23B are formed. The opaque layer is a material which is dissolved and removed by etching and peeling treatment. <P>COPYRIGHT: (C)2011,JPO&INPIT |
