发明名称 |
BONDING STRUCTURE AND METHOD OF FABRICATING THE SAME |
摘要 |
A bonding structure and a method of fabricating the same are provided. A first substrate having a first bonding element and a second substrate having a second bonding element are provided, wherein at least one of the first bonding element and the second bonding element is formed with an alloy. A bonding process is performed to bond the first bonding element with the second bonding element, wherein a diffusion liner is generated at the exposed, non-bonded surface of the bonding structure.
|
申请公布号 |
US2011195273(A1) |
申请公布日期 |
2011.08.11 |
申请号 |
US20100774731 |
申请日期 |
2010.05.06 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
CHEN KUAN-NENG;LO WEI-CHUNG;KO CHENG-TA |
分类号 |
B32B15/04;B32B15/01;B32B37/12 |
主分类号 |
B32B15/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|