发明名称 CONDUCTIVE PASTE COMPOSITION
摘要 The present invention relates to a conductive paste composition. The conductive paste composition includes a binder resin including a urethane group present in a main chain or a side chain, especially a binder resin formed from isocyanate and a polymer with at least one hydroxyl group, a fine powder, a glass frit, and a solvent. The conductive paste composition can have a superior physical property, improve productivity and an environmental problem by reducing waste fluid such as aqueous alkaline solution, and form a fine pattern having an improved structure. Accordingly, the paste composition is especially useful for a paste for gravure offset printing.
申请公布号 US2011193028(A1) 申请公布日期 2011.08.11
申请号 US200913060884 申请日期 2009.08.28
申请人 KIM JOO HO;KIM HWA JOONG;KIM IN CHUL 发明人 KIM JOO HO;KIM HWA JOONG;KIM IN CHUL
分类号 H01B1/20 主分类号 H01B1/20
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