发明名称 THERMAL MANAGEMENT COMPONENT FOR LED LIGHTING
摘要 <p>A heat sink (100) comprising a first member (101) and a second member (102) is provided. The first member is arranged for thermal contact with an object (103) from which heat is to be dissipated. The second member is in thermal contact with the first member. According to an embodiment of the invention, the second member consists of a thermal polymer molded around the first member. Further, a method for manufacturing a heat sink is provided.</p>
申请公布号 WO2011095919(A1) 申请公布日期 2011.08.11
申请号 WO2011IB50381 申请日期 2011.01.28
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V.;DIJKEN, DURANDUS, KORNELIUS;DORMAN, GERRIT, JAN, WILLEM, REINDER 发明人 DIJKEN, DURANDUS, KORNELIUS;DORMAN, GERRIT, JAN, WILLEM, REINDER
分类号 H01L21/48;H01L23/367;H01L23/373 主分类号 H01L21/48
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