METHOD OF MANUFACTURING SEMICONDUCTOR CHIP WITH ADHESIVE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor chip an adhesive protrusion of which is sufficiently reduced, and to provide a method of manufacturing a semiconductor device using the same.

SOLUTION: The method of manufacturing the semiconductor chip with the adhesive includes: preparing a laminate having a plurality of semiconductor chips arranged at intervals and a positive photosensitive adhesive layer made of a positive photosensitive adhesive composition in this order on a pressure-sensitive sheet; irradiating the positive photosensitive adhesive layer with an energy beam from the side of the pressure-sensitive adhesive sheet of the laminate; and then bringing a developer into contact with the positive photosensitive adhesive layer to pattern the positive photosensitive adhesive layer to obtain the semiconductor chip with the adhesive.

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