| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder jet device reducing adhesion of an oxide film on a surface of a jet nozzle to a soldering part of an electronic component even if mounting density of the electronic component on a mounting substrate is high. <P>SOLUTION: The solder jet device includes a substrate 11 on which the electronic component 10 having a lead part 10a is placed and which electrically connects the lead part 10a while it relatively moves; a solder tank having an external wall 4 storing flowing thermofusion solder 1; the cylindrical jet nozzle 3 in which a tip 3b is projectively stored on a substrate 11-side of the solder tank and whose inner part is hollow; a plurality of elongated grooves 3a which are disposed on an outer surface of the jet nozzle 3, start from the tip 3b and end midway, and are brought close to each other; a flow rate adjusting means 7 which blows up the thermofusion solder 1 to the lead part 10a from the tip 3b by press-feeding it inside the jet nozzle 3; and a gap which includes oxide 1a generated by oxidation reaction of the thermofusion solder 1 and is arranged between the jet nozzle 3 flowing back the thermofusion solder 1 which is blown up to the solder tank and the external wall of the solder tank. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
