| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a low-cost high-speed device which satisfies with a proper balance all of: suppression of interferences and connection between a power supply and a signal, suppression of power supply noises, suppression of interferences and crosstalks among signals, suppression of signal reflections due to discontinuity of impedance. <P>SOLUTION: In an interconneciton structure, signal bonding wires 31d, 31e, ground bonding wires 31b, 31g and power supply bonding wires 32a, 32c, 32f are arranged as described in the following section. Either the ground bonding wires or the power supply bonding wires is included in a first envelope that is identical to that of the signal bonding wires, and the other wires are included in a second envelope. In this case, the electromagnetic coupling among the bonding wires included in the second envelope and the signal bonding wires is smaller than electromagnetic coupling between the two bonding wires included in the first envelope. <P>COPYRIGHT: (C)2011,JPO&INPIT |
