发明名称 PLASMA CVD APPARATUS AND METHOD OF MANUFACTURING SILICON BASED FILM USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a plasma CVD apparatus, along with a method of manufacturing a silicon based film using the same, capable of forming a high quality silicon based film at a high speed for a substrate with a large area in order to improve an electricity generation efficiency and productivity, and further to achieve a low cost in an application of the plasma CVD apparatus in the field of manufacturing the microcrystal silicon film of a thin-film silicon solar cell and the passivation film of a polycrystal silicon solar cell or the like. <P>SOLUTION: In the plasma CVD apparatus with a pair of parallel plate electrodes, a plurality of recesses, and protrusions or flat portions are formed on one of the pair of electrodes, and a plurality of raw material gas blowout holes through each of which raw material gas is blew out are formed in the protrusions or flat portions, respectively, and a plurality of diluting gas blowout holes through each of which diluting gas is blew out are arranged in the recesses, respectively. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011155308(A) 申请公布日期 2011.08.11
申请号 JP20110103981 申请日期 2011.05.09
申请人 MURATA MASAYOSHI 发明人 MURATA MASAYOSHI
分类号 H01L21/316;C23C16/455;C23C16/509;H01L21/205;H01L21/31;H01L21/318;H01L31/04 主分类号 H01L21/316
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