发明名称 |
SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer capable of performing the exact evaluation of impurity distribution under a gate without giving damage to a silicon substrate, and a method for manufacturing the same. SOLUTION: The semiconductor wafer has a dummy filling unit with a W-shaped cross-sectional shape in a monitor region established in a predetermined place on the semiconductor substrate which has no electrical connection with the other unit. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011155273(A) |
申请公布日期 |
2011.08.11 |
申请号 |
JP20110046182 |
申请日期 |
2011.03.03 |
申请人 |
FUJITSU SEMICONDUCTOR LTD |
发明人 |
HASHIMI KAZUO;SATO TAKEKAZU |
分类号 |
H01L29/78;H01L21/66;H01L21/822;H01L27/04 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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