发明名称 WIRE GRID SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING SUCH A SUBSTRATE
摘要 The present invention relates to a multi-layered substrate structure comprising at least one carrier layer (11), a first layer (12), said carrier layer and first layer being in contact with each other, and at least one second layer with a chemical composition different from the first layer (13) said first and second layer being in contact with each other, the second layer forming apertures each having at least one in-plane dimension (W1) smaller than the diffraction limit, the diffraction limit being defined by a radiation wavelength of the excitation light. The invention further relates to the use and manufacturing process of such a substrate structure and a luminescence sensor.
申请公布号 US2011195516(A1) 申请公布日期 2011.08.11
申请号 US200913062568 申请日期 2009.09.08
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V. 发明人 KAHYA NERIMAN NICOLETTA;KLUNDER DERK J.W.
分类号 G01N21/76;B05D3/00;B05D5/06;B32B3/10;G01N21/64 主分类号 G01N21/76
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