| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for mounting an optical semiconductor element whose adhesion between a resin molding and lead electrode is good and which is excellent in reliability. <P>SOLUTION: The package 110 for mounting an optical semiconductor element, which has a recessed part 200 to be an area for mounting the optical semiconductor element, integrates a resin molding 103 which forms at least the side of the recessed part and is made up of a resin composition for thermosetting light reflecting and at least a pair of positive and negative lead electrodes 105 which are positioned against so as to form a part of the bottom of the recessed part. There is no clearance on the joint surface between the resin molding and lead electrode, and a spiral flow of the resin composition for thermosetting light reflecting is equal to or more than 50 cm and equal to or less than 300 cm. <P>COPYRIGHT: (C)2011,JPO&INPIT |
