| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photoresist stick proofing tape for preventing a photoresist from sticking on the surface of a substrate plate through such a way that, in the step of exposing high-energy beams to a printed wiring board coated with the photoresist on each of both surfaces of the printed wiring board in producing the board, the tape is stuck on the surface of the substrate plate for the photoresist-coated board to be left to stand at rest on. <P>SOLUTION: There is provided the photoresist stick proofing tape for preventing a photoresist from sticking on the surface of a substrate plate through such a way that, in the step of exposing high-energy beams to a printed wiring board coated with the photoresist on each of both surfaces of the printed wiring board in producing the board, the tape is stuck on the surface of the substrate plate for the photoresist-coated board to be left to stand at rest on. This tape comprises: a base material layer made of a resin; a release layer formed on one surface of the base material layer; and a crosslinked acrylic self-adhesive formed on the other surface of the base material layer; wherein the thickness of the base material layer is 100-250 μm and that of the self-adhesive 20-50 μm. This tape is such that: the peel tackiness at an angle of 180° with a test plate as measured by the method in accordance with JIS Z 0237 is 0.1-0.5 N/25 mm. <P>COPYRIGHT: (C)2011,JPO&INPIT |
