| 摘要 |
PROBLEM TO BE SOLVED: To provide a shield structure having improved heat dissipation efficiency, irrespective of applying a load on a solder section connecting an electronic component and a printed board, in a shielding structure which dissipates heat of electronic components inside a shielding case and which shields electromagnetically. SOLUTION: A hole 6 for a fin and a fin pressure bar spring 7 are provided in the top surface of a shield case 1, and a fin base 2b of a radiation fin 2 is pressed with the fin pressure bar spring 7 so that the radiation fin 2 is brought into pressure contact with an electronic component 3; and a fin section 2a of the radiation fin 2 is exposed to the outside of the shield case 1 through the hole 6 for a fin. COPYRIGHT: (C)2011,JPO&INPIT
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