| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a circuit interconnection wherein the line width of a circuit interconnection film constituting a circuit interconnection is fine, and a circuit interconnection having a uniform film thickness can be formed, and to provide a circuit board equipped with the circuit interconnection, and the circuit interconnection film wherein the line width is fine and the film thickness of an interconnection film having a uniform film thickness is larger than the width of the interconnection film. SOLUTION: The method of forming a circuit interconnection on a circuit board includes performing a trench formation process of forming a trench that corresponds to a shape of the circuit interconnection on an interconnection base material that forms the circuit interconnection, performing a liquid repellent process of at least the base material surface of the interconnection base material and a side wall surface of the trench with respect to a liquid body that includes a catalyst for forming a conductive layer, distributing the liquid body that includes the catalyst for forming a conductive layer on the trench, and forming a conductive circuit interconnection film that forms the circuit interconnection by distributing a plating solution in a range that includes the trench and depositing a conductive material from the plating solution through the catalyst for forming the conductive layer. COPYRIGHT: (C)2011,JPO&INPIT
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