发明名称 SILICON WAFER AND METHOD FOR PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a silicon wafer composed of a silicon crystal having high C-mode characteristics and excellent pressure-proof characteristics of an oxide film; and to provide a method for producing the silicon wafer. SOLUTION: This silicon wafer includes nitrogen and hydrogen, and is characterized in that: there exist a plurality of voids constituting a foamy void aggregate by≥50% in total number of voids; a V1 area where the void density exceeding 2×10<SP>4</SP>/cm<SP>3</SP>and <1×10<SP>5</SP>/cm<SP>3</SP>occupies≤20% in the total area of the silicon wafer; the V2 area where the void density is 5×10<SP>2</SP>to 2×10<SP>4</SP>/cm<SP>3</SP>occupies≥80% in the total area of the silicon wafer; and the inner microdefect density is≥5×10<SP>8</SP>/cm<SP>3</SP>. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011153069(A) 申请公布日期 2011.08.11
申请号 JP20100293890 申请日期 2010.12.28
申请人 SILTRONIC AG 发明人 NAKAI KATSUHIKO;OKUBO MASAMICHI
分类号 C30B29/06;C30B15/04 主分类号 C30B29/06
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