| 摘要 |
<p>PURPOSE: A semiconductor chip and a stacked semiconductor package including the same are provided to improve the accuracy of alignment by aligning a semiconductor chip by a concave groove which is formed in the top of a connection unit in stacking the semiconductor chip and improve junction reliability by preventing junction failure between a top and a lower semiconductor chip. CONSTITUTION: A semiconductor chip body(11) and a penetrating electrode(20) include a second side facing a first side and a circuit part. The penetrating electrode in a penetration part(22) passes through a first side and a second side. The upper side is formed to be connected to the penetration part in the first side and faces to the semiconductor chip body. A lower part faces to the semiconductor body. A protrusion part(23) is connected to the penetration part and is formed to be projected to the second side of the semiconductor chip body.</p> |
