| 摘要 |
PROBLEM TO BE SOLVED: To provide an enclosure capable of obtaining sufficient effect of heat dissipating, while keeping flexibility in component arrangement on a substrate. SOLUTION: The enclosure consisting of enclosures 51, 52, and 53 houses a substrate 54, carrying a heat-generating component 55 mounted thereon. The enclosure includes first and second enclosure members 51 and 52 opposite to each other, and a third enclosure member 53 disposed between the first enclosure member 51 and the second enclosure member 52; the third enclosure member 53 has a first plate member 531 disposed opposite to the substrate 54; a projection 532, projecting toward the substrate 54, is formed on a region of the first plate member 531, that corresponds to an region of the substrate 54 on which the heat generating component 55 is mounted, and the top of the projection 532 is brought into contact with the heat-generating component 55. As a result, a gap is formed between the substrate 54 and the first plate member 531. COPYRIGHT: (C)2011,JPO&INPIT
|
