| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit module which covers the surface of an insulating resin with a conductive material and prevents infiltration of moisture, from a brim of a coating layer of the conductive material into between the coating layer and the insulating resin. SOLUTION: The circuit module 1 includes a circuit component 2; a substrate 3 mounted with the circuit component 2; an insulating resin 4 for covering the circuit component 2 mounted on the substrate 3; a coating layer 5 that covers at least a part of the surface of the insulating resin 4 and comprising a plurality of conductive material layers; and a protruding portion 6 formed on the surface of the insulating resin 4 and at a position on the brim 5E of the covering layer 5. Of the brim 5E of the coating layer 5, the brim of the conductive material layer disposed at the outermost position comes into contact with the protruding portion 6. COPYRIGHT: (C)2011,JPO&INPIT
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