发明名称 |
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF |
摘要 |
The present invention provides a semiconductor device and a fabricating method thereof. The fabricating method comprises: providing a first substrate; forming a soft dry film having an adhesive film and a release film; sticking the soft dry film on the first substrate with the adhesive film; removing the release film; sticking a second substrate on the adhesive film; and heating the adhesive film to solidify the adhesive film to form a solid adhesive film. The semiconductor device comprises: a first substrate, a solid adhesive film, and a second substrate. The solid adhesive film is formed on the first substrate, and the second substrate is formed on the solid adhesive film.
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申请公布号 |
US2011195257(A1) |
申请公布日期 |
2011.08.11 |
申请号 |
US20100701615 |
申请日期 |
2010.02.08 |
申请人 |
HSIUNG HSIN-CHANG;HO SHU-LIN |
发明人 |
HSIUNG HSIN-CHANG;HO SHU-LIN |
分类号 |
B32B27/38;B32B38/10;H01L21/50 |
主分类号 |
B32B27/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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