| 摘要 |
PROBLEM TO BE SOLVED: To provide a jig for semiconductor element transfer capable of suppressing electric damage caused by static electricity to a semiconductor element. SOLUTION: The jig for semiconductor element transfer separates the semiconductor element 4 which includes a circuit element 6, an electrode pad 7 conductive with the circuit element 6, and an insulating member 8 covering the circuit element 6 so as to expose the electrode pad 7 on the main surface of the substrate 5 from a fixing tape 9. The jig for semiconductor element transfer includes a holding means 12 for sucking and holding the side of the semiconductor element 4 where the insulating member 8 is disposed, and the holding means 12 is formed using a static electricity diffusing material. The static electricity diffusing material forming the holding means 12 is a resin or ceramic. COPYRIGHT: (C)2011,JPO&INPIT |
