摘要 |
PROBLEM TO BE SOLVED: To provide a beam irradiation system and a semiconductor laser system for effectively removing laser beams emitted from the rear face side of laser chips with a simple configuration. SOLUTION: The beam irradiation system includes: a semiconductor laser 401; a lens 402 on which laser beams emitted from the semiconductor laser 401 impinge; and a scanning unit which causes the laser beams transmitted through the lens 402 to scan a targeted area. The semiconductor laser 401 has: a laser chip 401c; a cap 40a for housing the laser chip 401c; and an emission opening 401b formed in the cap and adapted to pass laser beams emitted from the laser chip 401c. The emission opening 401b has a function of an aperture which restricts an incident area of the laser beams into the lens 402. COPYRIGHT: (C)2011,JPO&INPIT
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