| 发明名称 |
AQUEOUS ACIDIC FORMULATIONS FOR COPPER OXIDE ETCH RESIDUE REMOVAL AND PREVENTION OF COPPER ELECTRODEPOSITION |
| 摘要 |
A highly aqueous acidic cleaning composition for copper oxide etch removal from Cu-dual damascene microelectronic structures and wherein that composition prevents or substantially eliminates copper redeposition on the Cu-dual damascene microelectronic structure.
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| 申请公布号 |
US2011195887(A1) |
申请公布日期 |
2011.08.11 |
| 申请号 |
US20090998296 |
申请日期 |
2009.10.06 |
| 申请人 |
WESTWOOD GLENN;HONG SEONG JIN;KIM SANG IN |
发明人 |
WESTWOOD GLENN;HONG SEONG JIN;KIM SANG IN |
| 分类号 |
C11D7/60;C11D3/60 |
主分类号 |
C11D7/60 |
| 代理机构 |
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