发明名称 |
Corner Stress Release Structure Design for Increasing Circuit Routing Areas |
摘要 |
An integrated circuit structure includes a semiconductor chip, which further includes a corner and a seal ring dispatched adjacent edges of the semiconductor chip; and a corner stress release (CSR) structure adjacent the corner and physically adjoining the seal ring. The CSR structure includes a portion in a top metallization layer. A circuit component selected from the group consisting essentially of an interconnect structure and an active circuit is directly underlying the CSR structure.
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申请公布号 |
US2011193198(A1) |
申请公布日期 |
2011.08.11 |
申请号 |
US20100702831 |
申请日期 |
2010.02.09 |
申请人 |
TAIWN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN HSIEN-WEI |
分类号 |
H01L23/48;H01L23/00 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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