发明名称 Corner Stress Release Structure Design for Increasing Circuit Routing Areas
摘要 An integrated circuit structure includes a semiconductor chip, which further includes a corner and a seal ring dispatched adjacent edges of the semiconductor chip; and a corner stress release (CSR) structure adjacent the corner and physically adjoining the seal ring. The CSR structure includes a portion in a top metallization layer. A circuit component selected from the group consisting essentially of an interconnect structure and an active circuit is directly underlying the CSR structure.
申请公布号 US2011193198(A1) 申请公布日期 2011.08.11
申请号 US20100702831 申请日期 2010.02.09
申请人 TAIWN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 CHEN HSIEN-WEI
分类号 H01L23/48;H01L23/00 主分类号 H01L23/48
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