| 摘要 |
An electroless nickel plating solution for solar cell electrode, which comprises SiNx and Si patterned structure, is disclosed. The electroless plating solution of the present invention comprises: nickel ion; a reducing agent; a first chelating agent; a second chelating agent; and water. The electroless plating solution of the present invention has high selectivity between Si and SiNx and is harmless to the aluminum-based layer, therefore is suitable for being used in the fabrication of the electrodes of the solar cell.
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