发明名称 MOLDING DEVICE FOR PRODUCING EPOXY PLASTIC-SEALED PRESSED AUTOMOBILE RECTIFYING DIODE
摘要 <p>A molding device for producing epoxy plastic-sealed pressed automobile rectifying diode includes an upper mould box (1) and a lower mould box (2). A first groove is provided along the length direction of a bottom surface of the upper mould box (1), and an upper wire pressing block and an upper cavity block are embedded in parallel in the first groove. The lower mould box (2) has two stepped planes which are a higher plane and a lower plane. A second groove is provided along the length direction of a top surface of the higher plane of the lower mould box (2), and a lower wire pressing block and a lower cavity block are provided in the second groove which correspond to the upper wire pressing block and the upper cavity block respectively. Numbers of upper wire pressing strips (3) and lower wire pressing strips (6) are respectively provided at the opposite side of the upper wire pressing block and the lower wire pressing block, and numbers of upper cavity strips (4) and lower cavity strips (7) are respectively provided at the opposite side of the upper cavity block and the lower cavity block. In this molding device of the present invention, a cavity is formed by the cavity strips of the upper mould box and the lower mould box, then epoxy molding compound is poured into the cavity, finally the product is pressed to form. The wire pressing strips ensure the seal of lead line end of core seat, and the slider ensures the seal of base end of core seat. The diode has good sealing performance, high reliability, low cost and simple process.</p>
申请公布号 WO2011094941(A1) 申请公布日期 2011.08.11
申请号 WO2010CN70522 申请日期 2010.02.04
申请人 KUNSHAN CHENYI SEMICONDUCTOR CO., LTD.;CAO, YU 发明人 CAO, YU
分类号 H01L23/28;B29C45/26;H01L21/56 主分类号 H01L23/28
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