| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive film for appropriately embedding irregularities generated by a plurality of circuits on a circuit board, to provide a semiconductor device using such an adhesive film, and to provide a multilayer circuit board and an electronic component. <P>SOLUTION: The adhesive film is used when mounting a semiconductor chip or a semiconductor package to the circuit board where circuits are formed and includes a flux function. When an adhering temperature for adhering the adhesive film to a surface where the circuits on the circuit board are formed is set to T[°C], pressure applied to the adhesive film is set to P [Pa], and the melt viscosity of the adhesive film at the adhering temperature is set toη[Pa s], a relationship of 1.2×10<SP>3</SP>≤(T×P)/η≤1.5×10<SP>9</SP>is satisfied, the adhering temperature T ranges from 60 to 150°C, the pressure P ranges from 0.2 to 1.0 MPa, and the melt viscosityηof the adhesive film at the adhering temperature ranges from 0.1 to 10,000 Pa s. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
