| 摘要 |
In one embodiment, signaling and ground contacts are located in at least two parallel, rectilinear rows along at least one edge of an interconnect package such as a BGA package. In one row, each of a plurality of ground contacts is located between two pairs of contacts for receiving differential signals. In the second row, each of a plurality of ground contacts is located between two pairs of contacts for transmitting differential signals and the ground contacts in the second row are offset by one column from the ground contacts in the first row. As a result, the ratio of signaling pairs to ground contacts is 2:2. Additional pairs of rows may also be used. In other embodiments, signaling and ground contacts are located in three parallel, rectilinear rows along at least one edge of the package. In the first row, ground contacts alternate with contacts for receiving differential signals and in the second row ground contacts alternate with contacts for transmitting differential signals. The third row of contacts is located between the first and second rows and contains contacts for receiving differential signals that alternate with contacts for transmitting differential signals. The ground contacts in the second row are offset by one column from the ground contacts in the first row. In a second embodiment, the receiving contacts in the third row are in the same column as the receiving contacts in the first row; and the transmitting contacts in the third row are in the same column as the transmitting contacts in the second row. In a third embodiment, the contacts in the third row are offset by one column from the corresponding contacts in the first or second rows. Each pair of contacts for receiving differential signals is formed by a contact in the first row and an adjacent contact in the third row; and each pair of contacts for transmitting differential signals is formed by a contact in the second row and an adjacent contact in the third row. |
