| 摘要 |
<p>Disclosed is a method for manufacturing an electronic device, whereby bonding strength of a sealing member in the electronic device is improved. Base layers (3, 3') are provided on respective peripheral portions of a pair of substrates (1, 4), one of which, i.e., the substrate (1) has an electronic element (2) formed thereon. A light absorbing layer (6) having a high absorption rate to visible light or near infrared light is formed on the base layer (3') provided on the substrate (4), and a low melting point metal layer (5) is provided on the base layer (3) provided on the substrate (1). The low melting point metal layer (5) is heated and melted by irradiating the light absorbing layer (6) with the visible light or the near infrared light through the substrate (4) and the base layer (3'), an alloy is formed of the light absorbing layer (6) and the low melting point metal layer (5), and a pair of substrates (1, 4) are bonded to each other.</p> |
