| 摘要 |
<p>A mounting system for applying an RFID chip module (2) having at least one electrical connection to a substrate (4) having at least one conductor, in particular a label, has the following features: a) a stamping device (10) for stamping out the RFID chip module (2) from a carrier strip (8) having a plurality of chip modules (2), wherein the stamping device comprises a stamping die (22) having a stamping opening (20), by which an RFID chip module (2) to be stamped out is received with accurate positioning, and a stamping punch (16) disposed above the stamping opening (20), and wherein a support (24) for receiving a substrate (4) with accurate positioning is disposed below the stamping opening (20) and the stamping punch (16) can be moved up against the substrate (4); b) a suction device (26) for holding the RFID chip module (2) on the stamping punch (16); and c) a heating device (12) for melting solder present on the RFID chip module (2) in order to establish a conductive connection between an electrical connection of the RFID chip module (2) and a conductor of the substrate (4).</p> |
