发明名称 |
APPLYING DIFFERENT PRESSURES THROUGH SUB-PAD TO FIXED ABRASIVE CMP PAD |
摘要 |
A chemical mechanical polishing (CMP) system includes a rotating polishing table including a platen providing at least two pressure zones having different pressures; a sub-pad positioned on the platen, the sub-pad including a plurality of openings allowing for transmission of the different pressures therethrough; a fixed abrasive pad positioned on the sub-pad; and a pressure-creating system sealingly coupled to the platen for creating a different pressure in the at least two pressure zones, wherein the different pressures create topography on the fixed abrasive pad. A sub-pad and related method are also provided.
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申请公布号 |
US2011195640(A1) |
申请公布日期 |
2011.08.11 |
申请号 |
US20100702333 |
申请日期 |
2010.02.09 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CELLIER GLENN L.;ECONOMIKOS LAERTIS;MCCORMACK TIMOTHY M.;VENIGALLA RAJASEKHAR |
分类号 |
B24B1/00;B24B7/20;B24B37/00 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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