发明名称 CLEANING LIQUID FOR LITHOGRAPHY AND METHOD FOR FORMING WIRING
摘要 Provided are a cleaning liquid for lithography that exhibits excellent corrosion suppression performance in relation to ILD materials, and excellent removal performance in relation to a resist film and a bottom antireflective coating film, and a method for forming a wiring using the cleaning liquid for lithography. The cleaning liquid for lithography according to the present invention includes a quaternary ammonium hydroxide, a water soluble organic solvent, water, and an inorganic base. The water soluble organic solvent contains a highly polar solvent having a dipole moment of no less than 3.0 D, a glycol ether solvent and a polyhydric alcohol, and the total content of the highly polar solvent and the glycol ether solvent is no less than 30% by mass relative to the total mass of the liquid for lithography.
申请公布号 US2011195573(A1) 申请公布日期 2011.08.11
申请号 US201113016868 申请日期 2011.01.28
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 OHHASHI TAKUYA;TAKAHAMA MASARU;ETO TAKAHIRO;MORI DAIJIRO;YOKOI SHIGERU
分类号 H01L21/768;C11D3/26 主分类号 H01L21/768
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