| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid sealing resin composition free from problems of plugging of an inorganic filler, a void and the like, and used in a semiconductor device assembled by a COF system or an SOF system. SOLUTION: This liquid sealing resin composition is used in the semiconductor device having a portion with two or more of connection parts existing between a circuit on a heat-resistant film and a semiconductor element mounted on the circuit, having 10μm or more to 50μm or less of space between the heat-resistant film and the semiconductor element in each connection part, and having 5μm or more to 25μm or less of space between the adjacent connection parts, the liquid sealing resin composition contains (A) an epoxy resin, (B) a curing agent, (C) the inorganic filler, and (D) an additive neutralizable of a surface charge of the inorganic filler, a content of the inorganic filler is 10 wt.% or more to 80 wt.% or less, an average particle size is 0.1μm to 0.5μm, and the maximum particle size is 5μm or less. COPYRIGHT: (C)2011,JPO&INPIT
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